市场趋势Market Trend
1. 南亚科4月营收回温，月成长10.54% 20190505
存储器大厂南亚科 3 日公布 2019 年 4 月营运数字，根据资料显示，在客户拉货增加，出货回温的情况下，4 月合并营收为 41.11 亿元（新台币，下同），较 3 月增加 10.54%，呈现连续第 2 个月正成长的情况。但是，在当前大环境仍旧不佳，半导体产业仍持续处于低档的情况下，4 月营收则是较 2018 年同期减少 46.48%。
2. ★★★Global Notebook Market 1Q Not So Bleak After All, Thanks to Excellent Shipment Performance by American Brands, Says TrendForce 20190509
TrendForce , a global market research institute, revealed in its latest notebook shipment report that although CPUs continued their trend of undersupply in 1Q19, it didn’t cause too big of an impact on the notebook market as a whole. Global notebook shipments for the first quarter came up to 36.97 million units, a miniscule 0.8% decline compared to the same quarter last year, which registered 37.27 million units.
3. ★★★集邦咨询：美系品牌出货亮眼，Q1全球笔记本电脑市场不淡 20190510
根据全球市场研究机构集邦咨询（TrendForce）最新笔记本电脑出货报告显示，尽管2019年第一季CPU仍处于供货不足状态，但笔记本电脑市场整体并未受到太大冲击。第一季全球笔记本电脑出货量达3,697万台，与去年同期的3,727万台相比仅衰退0.8%。
4. ★Memory Module Shipments Expected To Increase In Q2 2019 20190511
According to DigiTimes, Taiwan memory makers showed mixed results in the first quarter of the year, as the DRAM and NAND flash prices suffered a sharp decline. However, the companies are now expecting their sales performance to improve in the second quarter as demand for DRAM and NAND flash is set to increase.
5. ★★The US-China Trade War Escalates, May Send North American and Global Notebook PC Markets into Turmoil, Says TrendForce 20190514
May 10 th sees the US-China trade dispute escalating yet again as the US continues to hike tariffs on US$200 billion worth of Chinese imports, going from 10% to 25%. TrendForce points out that TVs , monitors, notebooks and other display products were not among the US$250 billion worth of goods hit by the 25% tariffs, thus the current impact on panels and the display industry remains to be fairly limited.
6. Apple Fell to Number Three in 1Q19, While a Worsening US-China Trade Dispute May Add Insult to Injury, Says TrendForce 20190516
According to investigations by global market research institute, TrendForce, despite the sudden orders in the first quarter, recovery was not as up to strength compared with the same period a year ago, due to customers’ declining desire to replace smartphones. The global smartphone production volume for 1Q19 totaled 311 million units, showing a YoY decrease of 9%. The outlook for 2Q19 indicates that smartphone demand will stabilize, and the traditional busy season for stock-up activities will arrive in the latter half of the second quarter. Thus the global smartphone production volume in 2Q19 is forecasted to register no significant YoY change over 2018, holding steady at the level of 350 million units. TrendForce further forecasts that the global production volume in 2019 will contract by 3.7% from 2018 to around 1.4 billion units.
7. 市场需求疲软+10nm扩产解危 英特尔CPU缺货问题或逐季舒缓 20190516
018年由于英特尔14nm产能不足，导致NB处理器芯片供不应求、10nm制程迟迟无法量产，加上竞争者在技术及市场上的威胁，使英特尔备受考验。
根据英特尔于2019年第一季财报电话会议中表示，10nm芯片将于2019年用在NB，然搭载Ice Lake-U处理器的新品需等到2019年底耶诞假期才能上市。
英特尔积极扩产弥补14nm产能不足缺口，同时为10nm及7nm做准备。
技术热点New Technology
1. LPDDR4X进入单颗8GB时代 ICMAX业内首家量产 20190506
重磅消息：宏旺半导体ICMAX宣布大规模生产单颗8GB LPDDR4X，这是业内首家量产。LPDDR4X 8GB量产表明ICMAX产品线日渐丰富完善，现提供全面先进的嵌入式存储产品，为搭载8GB移动DRAM和512GB存储的智能手机新时代提供更高性能，相信LPDDR4X 8GB上市后将对现有的手机市场造成强有力冲击。新的存储方案具有比多数手机运行更高的存储容量，使用户能够充分体验大存储时代的便利，不用再担心手机系统提醒“存储空间不足”。
2. Intel Announces Project Athena Open Labs 20190507
Today Intel announced that it is opening new Project Athena Open Labs in Taipei, Shanghai, and Folsom California, to test and certify the new Athena designs that will come to market in 2020.
Intel announced Project Athena, a new initiative designed to usher in the next wave of powerful laptops, at CES 2019. The program is reminiscent of Intel’s Ultrabook initiative that pushed the transition to thin-and-light designs, but Athena focuses on increasing performance and responsiveness within the form factors we’re accustomed to, meaning the company isn’t pushing for thinner devices. Athena-based designs will also deliver up to 20 hours of battery life, near-instant resumption from sleep states (the laptop will pop to life immediately when you open the lid), 5G connectivity, and AI technologies to improve productivity. These new devices will come to market from laptop OEMs, but Intel will co-develop and certify the products.
3. AMD Zen 4架构处理器或将采用台积电5纳米制程 20190507
根据日前 AMD 在财报发表会中的资料显示，2019 年 AMD 要推出的 Zen 2 架构 Ryzen 3000 系列处理器，将采用台积电 7 纳米制程，而 2020 年的 Zen 3 架构的处理器，则会使用内含 EUV 技术的加强版 7 纳米 + 制程。而现在有外媒指出，到了接下来的 Zen 4 架构处理器，AMD 就有可能使用台积电的 5 纳米制程。由于，日前的法说会上台积电已经对外公开了 5 纳米制程的相关细节。因此，如果一切顺利的话，AMD 就有可能在 2021 年使用 5 纳米制程来打造 Zen 4 架构的 Ryzen 5000 系列处理器。
4. Intel Process Technology Update: 10nm Server Products in 1H 2020, Accelerated 7nm in 2021 20190508
Intel provided an update regarding its upcoming fabrication technologies at its 2019 Investor Meeting. The company is on track to produce server-class products using its 10 nm manufacturing technology already in the first half of 2020, which is something that the company implied on for a while now, but never confirmed officially. What is relatively surprising is that Intel intends to start production of ccommercial chips using its 7 nm process already in 2021.
5. ★Intel Announces 10nm Tiger Lake Processors to Arrive in 2020 20190508
Intel made a wide range of announcements today at its 2019 Investor Day, including the unexpectedly-quick jump to the 7nm process, but Gregory Bryant, the head of Intel’s client team, made yet another announcement: Intel’s new 10nm Tiger Lake processors will come to market in 2020.
This isn’t entirely surprising, as these processors popped up on a recently leaked roadmap that indicated a 2020 release date. According to that information, these chips will come as four-core models that are confined to the Y- and U-Series for laptops.
6. 英特尔7纳米芯片发布时间敲定！芯片线路图曝光 20190509
在5月8日召开的投资者会议上，英特尔宣布，7nm产品将在2021年问世，首发产品为基于Xe架构、面向数据中心AI和高性能计算的GPGPU通用计算加速卡。
专为高阶PC打造的10nm芯片将在今年稍晚时候推出，服务器用10纳米芯片则预计会在明年初出炉。
7. ★SMART Modular Announces 32 GB SO-DIMMs for Extreme Environments 20190509
SMART Modular has introduced the industry’s first industrial-grade 32 GB DDR4 SO-DIMMs. The memory modules are aimed at ruggedized computing applications that require top-of-the-line capacity modules with improved reliability.
SMART Modular’s Smart Rugged 32 GB SO-DIMMs are rated for DDR4-2666 speeds and will be offered in ECC and non-ECC configurations. The modules use a specially-designed PCB underfill and conformal coating that is designed to protect from shock/vibration, humidity, and harsh chemicals in the air. The manufacturer does not disclose which memory chips it uses for the modules, but it is highly likely that the SO-DIMMs use 16 Gb chips rated for industrial temperatures and severe environments. As a result the DIMMs are rated for operation in a wide range of temperatures, from -40°C up to +85°C.
8. 新锐龙处理器内存兼容性大幅提升，DDR4-5000也不成问题 20190511
Techpowerup表示制作Ryzen专用DRAM计算器的作者@1usmus发现Zen 2架构在内存控制器有了很大的变化，它被外置到I/O核心上，新的锐龙处理器将拥有与Intel相同的内存超频能力，在制程Zen 2处理器的主板BIOS里面已经有了DDR4-5000这个选择，比现有的高出不少。
Infinity Fabric总线现在依然与内存频率相挂钩，这其实是现在锐龙处理器进行内存超频时的一大问题，DDR4内存能跑到5000MHz，但要IF总线跑到这频率就有点困难了，所以现在AMD给IF总线加了个1/2分频模式，启动后会以内存实际频率的一半运行IF总线。
9. ★英睿达推出原生DDR4-3200内存，没有马甲采用绿色PCB 20190513
此前有爆料称AMD Ryzen 3000系列CPU将会提供对DDR4-5000内存的支持，并且随着内存的降价，越来越多的人在装机的时候开始考虑高频内存。但是现在市面上的高频内存普遍有RGB马甲，如果你不喜欢光污染的话开盖还有可能会有奖。今天英睿达推出了原生DDR4-3200高频内存，提供4GB到16GB不同容量选择，采用了绿色PCB设计并且没有散热马甲，提供笔记本和桌面两个版本。
10. ★英特尔10纳米产品 6月出货 20190514
就在台积电及三星电子陆续宣布支援极紫外光（EUV）技术的7纳米技术进入量产阶段后，半导体龙头英特尔也确定开始进入10纳米时代，预计采用10纳米产品将在6月开始出货。同时，英特尔将加速支援EUV技术的7纳米制程研发，预期2021年可望进入量产阶段，首款代表性产品将是Xe架构绘图芯片。
11. ★联想展示可折叠PC，称已研发3年并于2020年推出 20190514
5月14日消息，美国奥兰多Accelerate大会上，联想展示了全球第一台可折叠屏电脑的原型机ThinkPad X1系列。
据悉，联想已经开发这款设备三年多，并计划在2020年推出一款成品，作为其高端ThinkPad X1品牌的主打产品。联想的目标是推出一款高端产品，类似笔记本电脑级别的设备，而不是平板电脑那样的配件或辅助电脑。
12. ★★Samsung to End B-Die DDR4: The Overclockers’ Favorite 20190514
For many years leading DRAM module manufacturers have used Samsung’s B-die 8 Gb memory chips for their fastest and most advanced DIMMs. This quarter Samsung intends to discontinue production of B-die, forcing its partners to find a worthy replacement.
According to Samsung’s most recent Product Guide, the company will EOL its B-die 8 Gb memory chips in Q2 2019. It is not particularly clear when exactly Samsung ceases to make its legendary memory chips, but it looks like it is time for companies like Corsair or G.Skill to stock pile B-die ICs for existing DDR4-4000 and faster kits.
13. ★★Adata Sets DDR4 RAM Overclocking World Record at 5,634 MHz 20190515
Adata’s XPG Overclocking Lab (XOCL) has managed to overclocked the brand’s RGB-lit Spectrix D60G memory to a staggering 5,634 MHz, as recorded by HWBot, dethroning the HyperX Predator as the fastest DDR4 memory on earth.
With this new milestone, Adata has proven that the Spectrix D60G memory doesn’t just look good but overclocks even better. The XPG Overclocking Lab paired the single Spectrix D60G 8GB memory module with the octa-core Intel Core i9-9900K CPU and MSI’s MPG Z390I Gaming Edge AC Mini-ITX motherboard to achieve this feat.
14. ★Samsung Samples 32 Gb DDR4 Memory Chips 20190515
Samsung recently began sampling of its 32 Gb capacity DDR4 memory chips. The new products will simplify production of high-capacity memory modules that use multiple DRAM packages.
Samsung’s 32 Gb A-die DDR4-2666 chips are comprised of two stacked 16 Gb DDR4 dies produced using the company’s 10 nm-class process technology. Samsung offers two versions of 32 Gb DDR4 packages: one featuring a 2G x8 organization, another featuring a 1G x16 organization. The former is seen by memory controller as two memory devices, whereas the latter is considered as one DRAM device. The DDPs (dual die packages) come in standard 78 or 96-ball FBGA form-factor and use the industry-standard voltage of 1.2 V.
行业动态Industry News
1. 传力晶现金增资再上市，想称台系晶圆三雄 20190505
消息指出，力晶集团将进行现金增资，并转让资产给子公司，以启动再上市计划。
据《自由时报》报导，自 5 月 1 日起，力晶科技将把 3 座 12 寸晶圆厂及相关营业资产让与子公司力积电，加上原有两座 8 寸厂，使其成为台湾地区第三大晶圆代工厂，总员工人数将近 7,000 多人，且预计在 2021 年以力积电为名再度上市，并于 31 日股东会时进行讨论。
2. 厦门发布招商地图，圈出半导体与集成电路领域六大发展重点 20190506
近年来，厦门聚焦发展电子信息、装备制造等五大产业集群，重点打造平板显示、半导体和集成电路等12条千亿产业链，日前厦门发改委发布其招商地图及投资机会清单，对半导体与集成电路领域作出招商引资规划。
3. Micron to Pay Intel $1.3B to $1.5B for IM Flash Stake 20190508
Earlier this year, Micron announced their intention to buy out Intel’s stake of their memory technology joint venture, IM Flash Technologies. Now, as the process gets underway, Micron is disclosing more concrete details about the transaction. According to the company’s latest filing, Micron will pay Intel approximately $1.3 billion to $1.5 billion for their stake and associated debt, with the expectation of closing the deal by the end of October.
4. IM Flash分手案最新进展，美光将支付至少13亿美元 20190508
美光 (Micron) 和英特尔 (Intel) 的“分手”很快将迎来正式官宣。
根据科技媒体Tom’s Hardware最新消息，在5月3日提交给美国证券交易委员会(SEC)的监管文件中，美光公司表示，合资企业Intel-Micron Flash Technology (IM Flash) 中英特尔所持有的非控股股权出售事宜将预于10月31日完成。
IM Flash成立于2006年，旨在联手美光和英特尔，共同合作研发NAND Flash和3D XPoint技术。这是一种非易失性内存技术，将会使用在英特尔Optane产品中。
5. 金泰克亮相日本IT Week Spring展会 ——旗舰新品G6水冷SSD备受瞩目 20190508
5月8日，世界上最大的ICT国际顶级展会之一——Japan IT Week(日本IT周)在东京有明国际展览中心拉开序幕。金泰克携多款精锐产品与全球众多领域的知名品牌（微软、华为、东芝、日立、NTT等厂商）在展会现场同台亮相。
6. 中芯国际12nm工艺开发进入客户导入阶段 20190508
5月8日，晶圆代工厂中芯国际发布其2019年第一季度业绩报告。一季度中芯国际营收、净利均有所下滑，但宣布12nm工艺开发进入客户导入阶段。
数据显示，中芯国际一季度实现销售额6.69亿美元，环比下降15.1%、同比下降19.5%，中芯国际表示主要由于一季度晶圆付运量减少及产品组合改变所致；实现毛利1.22亿美元，环比下降9.0%、同比下降44.6%，毛利率为18.2%；实现公司拥有人应占利润1227.2万美元，环比下降53.7%，同比下降58.2%。
7. 证监会放行，兆易创新收购思立微获重大进展 20190509
兆易创新发布公告表示，公司于2019年5月8日收到证监会核发的《关于核准北京兆易创新科技股份有限公司向联意（香港）有限公司等发行股份购买资产并募集配套资金的批复》。
8. 韩国半导体产业求变，存储器厂商加大逻辑芯片布局 20190514
市场传出海力士有意收购MagnaChip韩国清洲厂，若此交易成真，除海力士能借此提升自身8寸晶圆制造实力，增加自己于8寸晶圆代工市场的重要性外，MagnaChip也将以此资金持续开发新技术，甚至转型为专注芯片设计研发能力的半导体设计厂商。
9. 英特尔不打算扩产Nand Flash 或将迁移 3D XPoint产线到中国 20190514
根据国外科技媒体《Anandtechi》报导，由于 NAND Flash 市场当前供过于求的情况，造成市场价格不断下跌。因此英特尔（intel）决定 2019 年降低 NAND Flash 的产量。据英特尔执行长 Bob Swan 之前投资公告表示，英特尔未来短时间不会增加 NAND Flash 产能。因与存储器大厂美光（Micron）拆伙，英特尔决定把 3D XPoint / Optane 等 Flash 生产线移至中国。